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Loctite® 3610 CHIPBONDER® Syringe Dispense

 

Subcategory: Adhesive; Thermoset

Material Notes:

Surface Mount Adhesives
Loctite® Chipbonder® Surface Mount Adhesives (SMAs) maintain component positioning during wave solder and solder reflow processes. Loctite offers a variety of application techniques including syringe dispense, stencil print and pin transfer.

Loctite® syringe dispense products provide unmatched performance for electronics assembly:

  • High Speed Dispense
  • Low Temperature Cure
  • Products for difficult-to-bond substrates


Loctite® 3610 CHIPBONDER® Syringe Dispense
For high speed dot placement. Good green strength. A choice of colors for best vision pickup on light or dark surfaces.

Peaked dot profile.

Process Method:

  • High speed
  • Syringe dispensing
  • 40,000 DPH capable

Storage (Protect from heat): 40°F (+/-5°F) or 5°C (+/-3°C)

Available Properties
  • Cure Time
  • Shelf Life
  • Color
  
Property Data

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